This is an evolutionary position which will start in R&D and subsequently move to Operations as CSAC moves from prototype to pilot to full production.

The successful candidate will develop the necessary processes and supporting equipment to fabricate Chip Scale Atomic Clock (CSAC) physics packages.

These processes include:

• Handling, manipulation and assembly of small (<1 mm) structures under constraints of vacuum cleanliness
• Assembly includes solder reflow brazing of small structures using solder balls ( 0.006-0.014 inches diameter)
• Use of low outgassing adhesives
• Cleaning of subassemblies (using plasma and chemical etchants, solvents, etc) in preparation for anodic bonding of package assemblies
• Working with wirebond equipment
• Working with vendors to develop and validate processes, including most critically CSAC polyimide suspension
•  Working with optical assemblies, though expertise in optics can be learned at the required levels

Essential Qualifications:

• US Citizenship or US permanent residency (Green Card)
• Masters degree or BS and equivalent experience
• Thorough understanding of vacuum technology, including outgassing, cleanliness, vacuum equipment, etc
• Experience in micro-assembly and packaging of microelectronics

Desired Experience:

• Design of processes and fixtures for assembly in a manufacturing environment with annual quantities of 10K units or more
• Design of manufacturing processes using computer controlled machines
• Wafer handling

For information on some of our new technology developments, see http://www.symmttm.com/info_center_white_papers.asp#acd